个人简介

副教授,博士生导师。在华中科技大学获得学士学位,博士毕业于香港大学。此后,在新加坡南洋理工大学计算与数据科学学院从事博士后研究。2025年1月加入中山大学人工智能学院。长期从事计算机视觉,图像处理,质量评估,生成式人工智能等领域的相关研究。近年来,在TPAMI,TIP,CVPR, ICCV, ECCV, ICLR, ACM Multimedia, AAAI等国际一流的期刊和会议上发表论文30余篇。

 

研究与招生
  • 图像增强和编辑
  • 图像/视频质量和美学评估
  • 生成式人工智能(AIGC)

    欢迎对以上方向感兴趣的同学(博士后、博士研究生、硕士、访问生、本科生)加    入课题组。来信请附上: 简历(包括个人主页,Github,研究兴趣等), 成绩单,已发    表的论文或项目总结报告(如有)。邮件主题: 职位-姓名-学校-专业。

    更多信息

  • 个人主页: https://chaofengc.github.io/

     

     

工作经历

2025.01—至今,中山大学,人工智能学院,副教授

2021.09—2024.12,新加坡南洋理工大学,计算与数据科学学院,博士后

 

代表性论著 (#通讯作者, *共同一作)

1.Chaofeng Chen, Yang Sensen, Haoning Wu, Liang Liao, Zicheng Zhang, Annan Wang, Wenxiu Sun, Qiong Yan, Weisi Lin. Q-Ground: Image Quality Grounding with Large Multi-modality Models. ACM Multimedia (MM), 2024 (Oral).

2.Chaofeng Chen*, Annan Wang*, Haoning Wu, Liang Liao, Wenxiu Sun, Qiong Yan, Weisi Lin. Enhancing Diffusion Models with Text-Encoder Reinforcement Learning. European Conference on Computer Vision (ECCV), 2024.

3.Chaofeng Chen, Shangchen Zhou, Liang Liao, Haoning Wu, Wenxiu Sun, Qiong Yan, Weisi Lin. Iterative Token Evaluation and Refinement for Real-World Super-Resolution. Association for the Advancement of Artificial Intelligence (AAAI), 2024. 

4.Chaofeng Chen, Jiadi Mo, Jingwen Hou, Haoning Wu, Liang Liao, Wenxiu Sun, Qiong Yan, Weisi Lin. TOPIQ: A Top-down Approach from Semantics to Distortions for Image Quality Assessment. IEEE Transactions on Image Processing (TIP), 2024.

5.Chaofeng Chen*, Xinyu Shi*, Yipeng Qin, Xiaoming Li, Xiaoguang Han, Tao Yang, Shihui Guo. Real-World Blind Super-Resolution via Feature Matching with Implicit High-Resolution Priors. ACM Multimedia (MM), 2022 (Oral).

6.Chaofeng Chen, Xiaoming Li, Lingbo Yang, Xianhui Lin, Lei Zhang, Kwan-Yee K. Wong. Progressive Semantic-Aware Style Transformation for Blind Face Restoration. Computer Vision and Pattern Recognition (CVPR), 2021.

7.Chaofeng Chen, Dihong Gong, Hao Wang, Zhifeng Li, Kwan-Yee K. Wong. Learning Spatial Attention for Face Super-Resolution. IEEE Transactions on Image Processing (TIP), 2020.